layer
Scope
Date
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Earnings
SK Hynix’s Q1 profit soars on HBM chips, beats Samsung’s overall earnings
SK Hynix Inc., the world’s second-largest memory chipmaker, reported a dramatic surge in first-quarter profits on Thursday, delivering the sec...
Apr 24, 2025 (Gmt+09:00)
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Korean chipmakers
SK Hynix ships world’s first 12-layer HBM4 samples early
South Korean memory chip giant SK Hynix Inc. has begun delivering samples of the world’s most advanced, next-generation high bandwidth memory ...
Mar 19, 2025 (Gmt+09:00)
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Korean chipmakers
Nvidia asks SK Hynix to bring forward HBM4 supply by 6 months
Nvidia Corp.’s Chief Executive Jensen Huang has asked SK Group Chairman Chey Tae-won to supply 12-layer HBM4 chips, the most advanced AI chips...
Nov 04, 2024 (Gmt+09:00)
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Korean chipmakers
Samsung to unveil 400-layer bonding vertical NAND for AI servers by 2026
Samsung Electronics Co., the world’s largest memory chipmaker, plans to unveil a 400-layer vertical NAND flash chip by 2026 to lead the fast-g...
Oct 28, 2024 (Gmt+09:00)
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Korean chipmakers
SK Hynix chief says no delay in 12-layer HBM3E supply as demand soars
Kwak Noh-jung, chief executive of SK Hynix Inc., the world’s second-largest memory chipmaker, has said there will be no delay in the company&r...
Oct 23, 2024 (Gmt+09:00)
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Korean chipmakers
SK Hynix mass-produces 12-layer HBM3E for Q4 shipment
SK Hynix Inc. said on Thursday it has begun mass-producing the world’s first 12-layer HBM3E with a capacity of 36 gigabytes (GB) for shipment ...
Sep 26, 2024 (Gmt+09:00)
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Earnings
SK Hynix to supply 12-layer HBM3E to Nvidia in Q4; profit soars in Q2
SK Hynix Inc., the world’s second-largest memory chipmaker after Samsung Electronics Co., said on Thursday it has made a significant turnaroun...
Jul 25, 2024 (Gmt+09:00)
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Korean chipmakers
Samsung sets up team to win AI chip deal from Nvidia
Samsung Electronics Co., the world’s top memory chipmaker, established a team for a billions-of-dollars high-bandwidth memory chip supply deal...
May 06, 2024 (Gmt+09:00)
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Korean chipmakers
SK Hynix’s HBM chip orders fully booked; 12-layer HBM3E in Q3: CEO
ICHEON, Gyeonggi Province – SK Hynix Inc., the world’s second-largest memory chipmaker after Samsung Electronics Co., said on Thursday i...
May 02, 2024 (Gmt+09:00)
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Korean chipmakers
Samsung to produce 290-layer V9 NAND to win chip stacking war
Samsung Electronics Co., the world’s largest memory chipmaker, is set to begin mass production of 290-layer ninth-generation vertical (V9) NAN...
Apr 11, 2024 (Gmt+09:00)
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Electronics
Doosan unveils advanced CCL lineup at US IT equipment exhibition
South Korea's Doosan Corp. announced on Tuesday that it will showcase its high-end copper-clad layer (CCL) lineup, applicable to memory, system semi...
Apr 09, 2024 (Gmt+09:00)
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Korean chipmakers
Samsung doubles down in HBM race with largest memory
Samsung Electronics Co. has developed the industry’s first 36-gigabyte (GB) 12-layer high-value, high-performance memory chip in a bid to rest...
Feb 27, 2024 (Gmt+09:00)
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Chemical Industry
LG Display, LG Chem develop homegrown OLED material
South Korea’s LG Display Co. and LG Chem Ltd. have domestically produced a core material for organic light-emitting diode (OLED) that they pre...
Oct 10, 2023 (Gmt+09:00)
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Korean chipmakers
SK Hynix unveils another NAND to win chip stacking war
SK Hynix Inc., the world’s second-largest memory chipmaker after Samsung Electronics Co., showcased its progress in the chip stacking technolo...
Aug 09, 2023 (Gmt+09:00)
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Korean chipmakers
SK Hynix steps up chip stacking war with 238-layer 4D NAND
SK Hynix Inc., the world’s second-largest memory chipmaker after Samsung Electronics Co., has begun mass production of the industry’s hi...
Jun 08, 2023 (Gmt+09:00)
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Korean chipmakers
SK Hynix unveils industry’s slimmest 12-layer, 24 GB HBM3 chip
SK Hynix Inc., the world’s second-largest memory chipmaker, said on Thursday it has developed the world’s first 12-layer DRAM product wi...
Apr 20, 2023 (Gmt+09:00)
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Chemical Industry
Doosan Corp. starts building flexible copper-clad layer plant
South Korea's Doosan Corp. is expanding its production line for flexible cooper-clad layers (FCCL) to boost competitiveness in electronic materials ...
Dec 29, 2022 (Gmt+09:00)
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Korean chipmakers
Samsung’s new NAND boasts industry’s highest storage capacity
Samsung Electronics Co., the world’s largest memory chipmaker, has begun mass producing its latest NAND chip, which features the industry&rsqu...
Nov 08, 2022 (Gmt+09:00)
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Korean chipmakers
SK Hynix unveils world's first 238-layer NAND; Samsung SSD 20 times faster
Samsung Electronics Co. and SK Hynix Inc., the world’s two largest memory chipmakers, are set to overtake their rivals in the industry’s...
Aug 03, 2022 (Gmt+09:00)
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Korean chipmakers
Samsung, SK Hynix ahead of rivals in 200-plus-layer NAND chips
Samsung Electronics Co. and SK Hynix Inc., the world’s two largest memory chipmakers, are expected to lead rivals in the industry’s tran...
Feb 04, 2022 (Gmt+09:00)
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Tech, Media & Telecom
Samsung to adopt flatter hierarchy to lure young talent
Samsung Electronics Co. on Monday announced a set of drastic steps to reduce bureaucracy and hierarchical management at the world's top memory chip ...
Nov 29, 2021 (Gmt+09:00)
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Earnings
Samsung works on industry’s first 200-layer NAND as its Q2 profit jumps
Samsung Electronics Co. has made significant progress in developing a 200-layer vertical or V-NAND flash memory –the industry’s first &n...
Jul 29, 2021 (Gmt+09:00)
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Korean chipmakers
NAND competition heats up as SK Hynix unveils 176-layer flash memory
SK Hynix Inc. has developed 176-layer NAND flash memory, the industry’s highest-density chip, following in the footsteps of Micron Technology ...
Dec 07, 2020 (Gmt+09:00)
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Korean chipmakers
Samsung, SK Hynix challenged by underdog Micron’s 176-layer NAND
South Korea’s leading chipmakers Samsung Electronics Co. and SK Hynix Inc. are being challenged by smaller rival Micron Technology Inc.’s ...
Nov 16, 2020 (Gmt+09:00)
language
Latest News
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- 3 Trump Jr. meets Korean business chiefs in back-to-back sessions
- 4 Samsung in talks to supply customized HBM4 to Nvidia, Broadcom, Google
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