Doosan unveils advanced CCL lineup at US IT equipment exhibition

South Korea's Doosan Corp. announced on Tuesday that it will showcase its high-end copper-clad layer (CCL) lineup, applicable to memory, system semiconductors, communications networks and smart devices, at "IPC APEX EXPO 2024."

IPC APEX EXPO, held at the Anaheim Convention Center in California, is North America's largest exhibition of printed circuit boards and semiconductor packaging substrates.

This year, 430 companies, including global companies such as Resonac and EMC manufacturing CCL, are participating.

At this exhibition, Doosan Corp. will unveil various advanced CCL products, including CCL for memory and system semiconductor packaging, CCL for communications networks and flexible CCL for smart devices.

CCL for semiconductor packaging is a material that electrically connects semiconductor chips and mainboards and protects semiconductors. Its characteristics include rapid and accurate transmission of electrical signals and high strength to withstand high-temperature semiconductor processes.

CCL for communications networks is a product applied in data centers. Doosan Corp. will showcase 800 Gigabit Ethernet (GbE) CCL, which increases data processing speed and minimizes communications latency, and the next-generation 1,600 GbE CCL currently under development.

Flexible CCL (FCCL) is a core material for flexible printed circuit boards (FPCBs) that can bend flexibly. It is mainly used in smartphones and tablet PCs. Doosan Corp.'s FCCL has the durability to be folded and unfolded over a million times, making it suitable for the latest foldable phones.

In addition, Doosan Corp. will also exhibit CCL used in autonomous vehicle communication, next-generation electronic devices, 5G antennas and more.

"As the world's only supplier with a full lineup of high-end CCL products, we will solidify our top-tier position in the CCL market by meeting customer demands with differentiated competitiveness in supplying products in a timely manner," said a Doosan Corp. official.

Write to Hyung-Kyu Kim at khk@hankyung.com