FC-BGA

LG Innotek Co., a leading South Korean electronics parts maker, is for the first time supplying high-performance chip substrates for AI devices to g...

Samsung Electro-Mechanics Co., a leading South Korean electronics parts maker, plans to begin supplying hybrid lenses for automotive camera modules ...

Samsung Electro-Mechanics Co. and LG Innotek Co., two major South Korean suppliers for Apple iPhones, are going head-to-head in the artificial intel...

South Korea’s school and corporate uniform company Hyungji Elite announced on Monday that it was selected as the official partner of FC Barc...

Samsung Electro-Mechanics Co. has developed an advanced semiconductor substrate for autonomous driving, which is expected to drive the top South Kor...

South Korea’s LG Innotek Co. is preparing to mass produce flip chip ball grid array (FC-BGA) substrates from the fourth quarter of this year, ...

South Korea’s LG Innotek Co. will boost the production of its flip chip ball grid array (FC-BGA) packages, or high-density package substrates,...

South Korea’s LG Innotek Co. said on Wednesday it will invest 1.4 trillion won ($1.1 billion) in expanding facilities for semiconductor substr...

Samsung Electro-Mechanics Co. will expand its manufacturing facilities for high-performance package substrates in both South Korea and Vietnam, afte...

Samsung Electro-Mechanics Co. will supply its semiconductor package substrate to Apple Inc. for the US tech giant’s next-generation M2 process...