LG Innotek, Ansys forge digital twin technology partnership

South Korea's LG Innotek said on Thursday that it would expand the use of digital twin technology across its operations, partnering with engineering simulation software firm Ansys Corp.

Digital twin technology, which creates virtual replicas of physical objects to simulate real-world scenarios, is rapidly gaining traction in manufacturing for its ability to reduce product development time and costs.

Ansys, known for its advanced simulation capabilities using 3D modeling, AI, and machine learning, will help LG Innotek establish a top-tier digital twin environment.

LG Innotek has already reaped the benefits of digital twin technology through pilot projects with Ansys in specific processes.

The company plans to extend the technology to all product lines, including autonomous driving components such as vehicle connectivity and sensing.

In research and development, digital twins have significantly reduced the number of experiments and development time.

Digital twin technology significantly reduced the development period for semiconductor package substrates (PS) by up to 99%.

Additionally, through 3D modeling simulations, the technology shortened the time required to predict substrate warpage from 11 days to 3.6 hours.

The technology has also been instrumental in optimizing the production process for flip-chip ball grid array (FC-BGA), halving the ramp-up period to boost production capacity.

LG Innotek has enhanced soldering process efficiency for vehicle electronic components, aiming for a 40% productivity increase through further optimization.

Through its collaboration with Ansys, LG Innotek intends to expand digital twin technology to all product lines, including emerging areas like vehicle communication modules and LiDAR.

The company envisions extending the technology across the entire value chain, from development to production, to encompass customers and partners.

Write to Eui-Myung Park at uimyung@hankyung.com