bufferless HBM4

Samsung Electronics Co., the world’s leading memory chipmaker, is in talks to supply customized sixth-generation high-bandwidth memory, or HBM...

Samsung Electronics Co. will accelerate its push into robotics, medical technology and next-generation semiconductor markets to secure new growth dr...

South Korean memory chip giant SK Hynix Inc. has begun delivering samples of the world’s most advanced, next-generation high bandwidth memory ...

SK Hynix Inc. will adopt the 3-nanometer process, the most advanced foundry technology available, to produce customized HBM4 chips in the second hal...

Samsung Electronics Co. and SK Hynix Inc. are said to each be developing a sixth-generation high-bandwidth memory (HBM4) chip prototype for Tesla In...

Nvidia Corp.’s Chief Executive Jensen Huang has asked SK Group Chairman Chey Tae-won to supply 12-layer HBM4 chips, the most advanced AI chips...

TAIPEI – South Korea’s Samsung Electronics Co., the world’s largest memory chipmaker, is partnering with its foundry rival Taiwan ...

Samsung Electronics Co., the world’s top memory chipmaker, plans to use its cutting-edge 4-nanometer (nm) foundry process for the mass product...

South Korean chipmaker SK Hynix Inc., just like its global peers, has largely designed and produced semiconductors in-house, including high-bandwidt...

SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a te...

SILICON VALLEY -- Samsung Electronics Co. on Friday showcased a number of new-concept, next-generation DRAM chips, including the industry’s mo...

Samsung Electronics Co., the world’s top memory chipmaker, aims to introduce sixth-generation top-performance High Bandwidth Memory4 (HBM4) DR...