LIG Nex1, Electroninks to team up for component materials

South Korea's LIG Nex1 Co. said Tuesday it signed a memorandum of understanding (MOU) with the US-based Electroninks Inc. to research and develop next-generation component materials.

The two companies will collaborate on developing prototypes for government projects and expanding business opportunities in the defense sector. 

Under the MOU, both sides plan to research and develop composite conductive inks, a cutting-edge material technology.

Electroninks specializes in proprietary metal complex conductive ink solutions, offering a full suite of materials, including silver, gold, platinum, nickel, and copper.

Conductive inks are used in applications, including printed circuit board manufacturing, semiconductor packaging, and consumer electronics.

Write to Hyung-Kyu Kim at khk@hankyung.com