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Qualcomm, Samsung execute tech to improve 5G performance

The two tech giants accomplish world’s 1st simultaneous 5G two uplink and four downlink carrier aggregation for FDD spectrum

By Sep 08, 2023 (Gmt+09:00)

1 Min read

(Courtesy of Qualcomm)
(Courtesy of Qualcomm)

Qualcomm Inc., the leading global mobile chip maker, and Samsung Electronics Co., the world’s second-largest smartphone manufacturer, have successfully executed new technology to improve 5G performance and flexibility.

Qualcomm and Samsung performed simultaneous 5G two uplink and four downlink carrier aggregation for frequency division duplexing (FDD) spectrum for the first time in the world, according to the US chipmaker on Friday.

The test was completed using a mobile phone form-factor test device powered by Qualcomm’s Snapdragon X75 5G Modem-RF System and Samsung's 5G dual-band and tri-band radios supporting advanced carrier aggregation technology.

Snapdragon X75, the world’s first modem-radio frequency (RF) system with a dedicated artificial intelligence tensor accelerator, achieved 200 megabits per second (Mbps) uplink peak speeds with just 35 megahertz (MHz) of 5G spectrum, according to Qualcomm. The system also executed 1.3 gigabits per second (Gbps) downlink peak speeds with just 75 MHz of 5G spectrum.

“This achievement increases flexibility for operators with fragmented FDD spectrum assets, bringing faster upload speeds to more consumers across a multitude of markets and networks,” Qualcomm said in a statement.

INCREASING DEMAND FOR INCREASED UPLINK CAPACITY

The demand for increased uplink capacity has been growing as more customers used higher uplink-heavy applications such as video uploads, video conferencing, social media sharing and cloud applications.

The accomplishment is the latest milestone to deliver on the promise of  Snapdragon X75 to bring faster 5G to more users around the world, Qualcomm said.

“Our sixth generation modem-to-antenna solution was designed to future-ready 5G launches globally and bring numerous world’s first connectivity features to support the wide range of consumer and enterprise use cases,” said Sunil Patil, vice president for product management of Qualcomm Technologies Inc., a subsidiary of the US chipmaker.

Snapdragon X75 is currently sampling to customers, with commercial devices expected to launch in the second half.

Write to Ye-Rin Choi at rambutan@hankyung.com
 

Jongwoo Cheon edited this article.
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