SGC eTEC E&C completes chip packaging plant in Vietnam

South Korea's SGC eTEC E&C Co. on Thursday announced the completion of a cutting-edge semiconductor packaging facility in Vietnam's Yen Phong 2C Industrial Park.

The facility, spanning 230,000㎡—equivalent to 32 international soccer fields—emphasizes the company's expanding footprint in the global construction sector.

This advanced construction, featuring an expansive semiconductor cleanroom that controls contaminants, temperature, humidity, and pressure, highlights SGC eTEC E&C's engineering expertise.

Last July, the firm secured a $300 million agreement with Amkor Technology to construct the plant. Surpassing industry norms, SGC eTEC completed the project in a mere 15 months, compared to the typical 18-month timeframe for similar projects.

The project's culmination was celebrated in a ceremony attended by Lee Bok-young, SGC Group's chairman and Ahn Chan-gyu, SGC eTEC E&C's president. Deputy Prime Minister of Vietnam, Tran Luu Quang, and representatives from Amkor Technology were also in attendance.

Write to Jin-Woo Park at jwp@hankyung.com