Korean chipmakers
SK Hynix ships DRAM with world’s largest capacity to Oppo
The 24GB LPDDR5X to be mounted to the OnePlus Ace 2 Pro, a new flagship smartphone of Oppo’s subsidiary OnePlus
By Aug 11, 2023 (Gmt+09:00)
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SK Hynix Inc., the world’s second-largest memory chipmaker, supplied DRAM chips with the industry’s largest capacity for mobile devices to customers such as Chinese smartphone maker Oppo.
SK Hynix said on Friday that it began shipping the world’s first 24-gigabyte (GB) Low Power Double Data Rate 5X (LPDDR5X) mobile DRAM package after mass production of the low-power, high-efficiency chip, which the company hopes to become the industry’s new standard soon, started in November last year.
The South Korean tech giant said it has been supplying the 24GB LPDDR5X to Oppo since July. The Chinese company is set to install the chip in the OnePlus Ace 2 Pro, a new flagship smartphone of Oppo’s subsidiary OnePlus Technology Co.
“With the timely supply of 24GB LPDDR5X from SK Hynix, we were able to become the first to launch a smartphone that features the industry’s largest capacity DRAM,” said Louis Li, Oppo’s vice president for marketing, in a statement of SK Hynix. “This new smartphone will allow customers to enjoy an optimized multi-tasking environment as well as extended battery life.”

TO TRANSFER 13 FHD MOVIES IN ONE SECOND
The 24GB LPDDR5X package operating in the ultra-low voltage range of 1.01V to 1.12V can process 68GB of data per second, which is equivalent to transferring 13 full-HD movies in one second, according to SK Hynix.
It is crucial to enhance the performance of memory chips for smartphones in order to incorporate artificial intelligence into the mobile devices, the company said.
“Along with a faster advancement in the broader IT industry, our LPDDR products will be able to support a growing list of applications such as PC, server, high-performance computing (HPC) and automotive vehicles,” said Park Myoungsoo, SK Hynix head of DRAM marketing.
The company’s latest mobile DRAM chip LPDDR5T is expected to be mounted on MediaTek Co.’s next-generation mobile application processor (AP) chipset dubbed Dimensity.
Write to Ik-Hwan Kim at lovepen@hankyung.com
Jongwoo Cheon edited this article.
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