-
AutomobilesHyundai files for 1st overseas unit IPO in India: reports
Hyundai Motor Co.'s Indian unit filed for an initial public offering with the Securities and Exchange Board of India on Saturday...
Jun 16, 2024 (Gmt+09:00)
-
Korean chipmakersSamsung to launch 3D HBM chip packaging service in 2024
SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) w...
Jun 16, 2024 (Gmt+09:00)