Hanmi Semiconductor wins $110 mn HBM equipment order from SK Hynix

South Korean chip equipment company Hanmi Semiconductor Co. announced on Friday that it has received an order from SK Hynix Inc. for its dual TC bonder Griffin equipment used in high-bandwidth memory (HBM) manufacturing.

The contract amount is 149.9 billion won ($109.5 million). This is 94.28% of last year's consolidated sales of 159 billion won.

The dual TC bonder Griffin is equipment for attaching and stacking semiconductor chips made with through-silicon via (TSV) technology onto a wafer.

Previously, Hanmi Semiconductor received orders worth more than 200 billion won for this equipment from SK Hynix.

With the latest supply contract, the cumulative order value has reached 358.7 billion won.

Write to Jeong-Soo Hwang at hjs@hankyung.com