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Hidden Champions


Koh Young Technology是領先的基於3D測量的檢查和解決方案提供商。 自2006年以來,Koh Young憑藉其先進的3D技術一直領先於全球錫膏檢測(SPI)市場,該技術可在印刷電路板(PCB)製造過程的安裝階段之前準確地測量焊料量。 該公司在擴大3D自動化光學檢查(AOI)市場方面發揮了先鋒作用,併計劃通過加強智能工廠改造解決方案以及基於3D測量的腦外科機器人開發的多元化,在5年內達到1萬億韓元的年收入。 它已累積的數據。

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现为Koh Young Technology首席执行官的韩国机器人工程师Kwang-ill Koh于2002年做出了人生的决定,享年45岁。Koh决定在Mirae Corporation工作,该公司是快速发展的半导体设备领域的一家有前途的公司创立自己的公司做出此决定的主要原因是什么?他说,他梦想着“立即研究和开发我想要的所有产品。”

Koh在创立公司时就没有考虑到特定的产品。取而代之的是,他开始了长达6个月多的无休无止的访问韩国电子公司的生产现场和设施的工作,从而开始了新的旅程。 Koh认为,这样的现场探索将使他能够发现甚至客户自己也很少考虑的新需求领域。

因此,这个市值达1.3万亿韩元的全球B2B冠军的故事开始了。 Koh Young现在几乎保留了所有主要的全球电子公司作为其客户。 Koh Young的成长故事,在为电子产品制造过程提供检查设备的良好记录之后,近来扩展到了智能工厂解决方案和外科手术机器人领域,这始于Koh和他的年轻同事们的充分信心,他们相信,凭借自己的技术专长,他们可以“创造一个以前不存在的新市场。”


  • [產品與價值主張]通過精確定位降低成本

    The biggest concern that the engineers had shared was the product defect issue. Where exactly did the defective products come from? Koh discovered that the defect issue typically had to do with the solder paste, which is a type of adhesive used when mounting the electronic components onto the printed circuit board (PCB). Specifically, if the amount of solder printed onto the desired area is insufficient, the electronic components do not adhere well. But if an excessive amount of solder is applied, the components will be stuck together more than the required level, creating a short circuit. Koh figured that 70% of PCB defects occurred early in the process, during the solder printing stage of the production line.

    The issue at hand was that it was extremely difficult to inspect every single PCB, produced at amounts ranging from several hundred to tens of thousands per day. Considering such circumstances, the typical practice in the industry was to inspect only a selected number of samples with 2D microscopes. There was another issue with the microscopes being 2D – the inspector could confirm the location of where the solder was applied, but could not measure the amount or the volume of solder that was in place.  

    Koh judged that his company could secure these electronics companies as new customers if he could come up with a 3D optical inspection equipment that automatically inspects every single product on whether the solder had been properly printed onto PCB.

    The initial reaction of his colleagues to Koh’s ambitious idea was negative. In order to properly inspect the solder printed in cone-shaped forms, a 360-degree view was necessary. But no such equipment existed anywhere in the world that could so quickly measure and inspect the products. But Koh thought from a different angle. The fact that such equipment existed nowhere was the “exact reason why we must do it”, said Koh and asked his colleagues to follow his lead.

    After more than a year of pulling all-nighters every day, Koh Young Technology finally made a breakthrough success in 2003 by developing a 3D solder paste inspection (SPI) equipment. The reaction of the customers to Koh Young’s success was simply explosive.  

    How 3D Inspection Equipment Is Used in Electronic Product Manufacturing Process

    “The process of producing the PCB by mounting electronic components such as semiconductor chips onto the board is called Surface Mount Technology (SMT). SMT process is composed of 3 stages. First, the solder is printed onto PCB. Second, the electronic components are mounted to the board. Third, there is the reflow oven process during which the board is heated,” said Koh. “How much the cost can be reduced is determined by the stage that the product defects were identified. If the engineers can identify the defects prior to the mounting stage, they can just clean the board. However, if the defects are identified after mounting the chips, the expensive chips must be taken off and destroyed.”

    The customers that experienced the benefits of cost reduction from Koh Young’s SPI equipment further asked Koh to come up with another 3D inspection equipment for the stages after solder printing. They asked for a separate equipment that could inspect first, whether the components were properly placed onto the solder before they could be put into the oven (Pre-AOI stage), and second whether the components were firmly fixed onto the circular board after coming out of the oven. Koh Young again satisfied the customer demands by developing in 2010, for the first time in the world, the 3D Automated Optical Inspection (AOI) that could identify defects in those stages.

    One global customer in Germany had actually conducted an experiment directly comparing Koh Young’s 3D AOI equipment to a typical 2D inspection equipment. The customer inspected 1,000 PCBs with each equipment and compared the results. The 2D equipment concluded that 247 PCBs out of 1,000 were defective, while Koh Young’s 3D equipment identified 23 defective PCBs. The engineers at the German company then further checked the PCBs that were identified as defective with microscopes to confirm the accuracy.

    It was found that only 18 out of 247 PCBs that were determined faulty by the 2D equipment were truly defective, while 20 out of the 23 PCBs that Koh Young’s 3D AOI equipment judged faulty were true. The customer was impressed. CEO Koh stated that “such result means that there had been so many ‘false defects’ that had categorized faultless products as defective ones,” adding, “the cost reduction impact by minimizing such ‘false defects’ is tremendous.”

By Nak-Hoon Kim and Gayung Chu; edited by Daniel Cho (