Doosan participates in Asia's largest electronics exhibition

South Korea's Doosan Corp. is participating in Nepcon Japan 2023 held at Tokyo Big Site, Japan, from Jan. 25 through 27 to showcase its high-end technology for copper-clad laminate (CCL) products.

Neptcon Japan is one of Asia's leading exhibitions for electronics R&D, manufacturing, and packaging technology.

More than 1,400 companies from around the world are taking part in the event, which marks its 37th anniversary this year.

Doosan is showcasing its lineup of value-added CCL products, base materials for printed circuit boards (PCBs), along with its manufacturing technology.

They include CCL for electric radar based on PTFE resin materials, CCL for semiconductor packages, CCL for mobile devices memory semiconductors, and CCL for wireless communications equipment.

CCL is formed by the lamination of copper foil onto both sides of resin-impregnated glass fabric sheets, and the mixing ratio of resin determines the performance of CCL and printed circuit board (PCB).

Doosan has focused on nurturing CCL as a strategic growth area, exerting efforts to develop higher value-added products and expand production lines.

Its electronic materials business division Electronic BG has developed an optimal resin mixing ratio that can produce high performance by utilizing 50 years of experience and know-how since 1974.

It also developed polytetrafluoroethylene (PTFE) resin, an insulating layer having ultra-low loss characteristics, which is mainly used in special fields such as space and aviation.

When used in CCL for communications network boards, it can also respond to high-spec demand such as ultra-high frequency and 6th generation (6G).

To promote its CCL products and technology, Doosan has been actively participating in overseas trade shows. In November last year, it took part in Europe's largest electronic parts exhibition 2022 Electronica in Munich, Germany.

Write to Seo-woo Jang at suwu@hankyung.com